Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.
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Sn Tin |
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| Physical property:atomic number is 50,atomic weight is 118.71.Density is 7.28g/cm3,melting point is 231.88℃,boiling point is 2260℃. White glossy soft metal. | |||
| Chemical property:On the surface of tin generate two tin oxide protective film and remain stable in the air,but it accelerate the oxidation reaction when heating.Tin can react with the halogen and generate the four tin halides,besides it can also react with sulfur. | |||
| Specification | Sn-5N(99.999%) | Sn-6N(99.9999%) | Sn-7N(99.99999%) |
| Total impurity content | ≤10ppm | ≤1ppm | ≤0.1ppm |
| Application | Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor. | ||
Special Pallet in container
Unless otherwise specified, the tin ingot products should be stored in a dry, cool and moisture proof area. Best used within 12 months after production date. The tin ingot should remain in their original packaging until just prior to use. The tin ingot products are suitable for delivery by the way of ship, train, or truck.